WET System
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- D-E-S, SR Pre-treatment,
Deflux, Roll 2 Roll -
Basic Specifications - Moving : Horizontal, vertical, inclined
- Drying : Special air knife + high power air blow system
- New concept special jig
- Non-contact processing
- Double side processing
- Two stage conveyor -
Application - Patterning of PCB process
- Up to 0.03*500*500mm - Á¦Ç°¹®ÀÇ inseok.h@stinc.co.kr
- D-E-S, SR Pre-treatment,
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- For Wafer & PLP
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Stripper / Deflux - Special air knife(Dual Slit)
- Non-contact processing
- High Pressure Spray
- Large-flow Mixing System / no-load magnetic return
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Etcher (Q-Etcher / Flush / Ti / Cu)
Developer (DF / TMAH) - IR Oven Dry System
- Q-OSC Etching System
- High Temp Control System
- Etching Chemical Mixing / Precision levels(concentration)
control System
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Panel Cleaning
Acid-Chemical preprocessing Cleaning - EUV Process Cleaning
(High M/S / USC / AQJ / Water Jet )
- High Temp Cleaning System
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Wet Cleaner/DIP Process - High USC Processing
(Tray and CST Dipping / Micro Bubble Supply System)
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Wafer/PLP Foup Cleaner - High Cleaning System(Hot DIW / Steam / Hybrid)
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Wet Cleaner/DIP Process - Wafer & Glass Side Grinding
- 2Had & 4Had Grinding
- Á¦Ç°¹®ÀÇ inseok.h@stinc.co.kr